Thermal Properties of an Epoxy Cresol-Formaldehyde Novolac/Diaminodiphenyl Sulfone System Modified by Bismaleimide Containing Tetramethylbiphenyl and Aromatic Ether Structures
作者：Bo Xuan Zhou, Yi Jun Huang, Xing Hong Zhang*, Zhi Sheng Fu, Guo Rong Qi
關(guān)鍵字：Epoxy，Thermal Properties，Bismaleimide
論文來源：期刊
具體來源：POLYMER ENGINEERING AND SCIENCE—-2009
發(fā)表時間：2009年
A bismaleimide monomer, 4,40-bis(4-maleimidophenoxy)- 3,30,5,50-tetramethyl biphenyl (BMITB), was synthesized in high yield (94%) via a facile four-step reaction
from 2,20,6,60-tetramethyl-4,40-biphenol. The chemical structure of BMITB was confirmed by FTIR, 1HNMR, 13C NMR and elemental analysis. The monomer used to modify the epoxy cresol-formaldehyde novolac resin (ECN)/diaminodiphenyl sulfone (DDS) system. Cured ECN/BMITB/DDS blends with higher BMITB content had two distinct glass transition temperatures that were above 250℃ according to differential scanning calorimetry, indicating that an interpenetrated polymer network structure may be formed. The initial thermal decomposition temperature and integral procedure
decomposition temperature of the cured ECN/BMITB/DDS blends were >390 and 1080℃, respectively, according to thermogravimetric analyses. No phase separation was observed in dynamic mechanical analysis of cured ECN/BMITB/DDS blends with small amounts of BMITB (5 and 10 wt%).