[Composites Part A]Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method
作者：Junwei Gu, Zhaoyuan Lv, Yalan Wu, Yongqiang Guo, Lidong Tian, Hua Qiu, Wanzheng Li and Qiuyu Zhang
關鍵字：Polymer-matrix composites (PMCs); Thermal properties; Electrospinning; Compression moulding.
論文來源：期刊
發表時間：2017年
Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) & dielectric loss tangent (tanδ), and extremely outstanding thermal stability, λ of 0.696 W/ mK, ε of 3.77, tanδ of 0.007, THeat-resistance index (THRI) of 279oC and glass transition temperature (Tg) of 240oC, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.
http://dx.doi.org/10.1016/j.compositesa.2016.12.014