[Science Bulletin] Architecting optimized thermal conduction pathways in colonnade-structured polydimethylsiloxane-based thermal interface materials by direct ink writing
作者：Kunpeng Ruan, Yuanyuan Tian, Yujia Tian, Mukun Li, Kun Zhou*, Junwei Gu*
關鍵字：Direct ink writing; 3D printing, Colonnade-structure, Thermal interface materials, Thermal conduction pathways
論文來源：期刊
發表時間：2026年
Kunpeng Ruan, Yuanyuan Tian, Yujia Tian, Mukun Li, Kun Zhou*, Junwei Gu*. Architecting optimized thermal conduction pathways in colonnade-structured polydimethylsiloxane-based thermal interface materials by direct ink writing. Science Bulletin, 2026, 10.1016/j.scib.2026.03.011. 2024IF=21.1.（1區綜合類Top期刊，中國科技期刊卓越行動計劃-領軍類期刊項目）
https://doi.org/10.1016/j.scib.2026.03.011
Abstract
The rapid rise in chip heat generation places increasing demands on thermal interface materials (TIMs), requiring higher thermal conductivity and more efficient thermal conduction pathways. Here, we introduce a new design strategy for TIMs that directs heat transfer in three stages: horizontal distribution, vertical transfer, and horizontal dissipation. Using the direct ink writing three-dimensional printing technique, we fabricate polydimethylsiloxane (PDMS)-based TIMs with a colonnade-inspired architecture. The top and bottom “corridors” are formed from a boron nitride nanosheet (BNNS)/PDMS composite, where BNNS fillers are aligned in the in-plane direction to enhance lateral heat conduction. The central “pillar” layer is composed of a reduced graphene oxide (rGO)/PDMS composite, with rGO fillers aligned in the through-plane direction to promote vertical heat transfer. Compared with conventional PDMS-based TIMs containing randomly dispersed fillers or sandwich structures with only in-plane alignment, our prepared colonnade-structured PDMS-based TIMs demonstrate significantly improved thermal conductivity and reduced thermal resistance for interfaces.
高性能芯片正向小型化、集成化和高處理速度的方向快速發展，隨之帶來芯片發熱量急劇增加的問題，進而對熱界面材料（TIMs）的導熱性能和散熱效率提出了更高的要求。TIMs的導熱性能和散熱效率的核心在于導熱通路設計，然而常規的單向導熱通路設計已無法滿足高散熱需求，需要對TIMs內導熱通路進行進一步優化。本文提出先水平均熱、再垂直傳熱、最后水平散熱的導熱通路設計理念，利用墨水直寫（DIW）3D打印技術制備了具有柱廊結構的聚二甲基硅氧烷（PDMS）基TIMs：其頂面和底面為“廊”，由氮化硼納米片/PDMS（BNNS/PDMS）導熱復合材料組成，其中BNNS填料沿面內方向取向；中間層為“柱”，由還原氧化石墨烯/PDMS（rGO/PDMS）導熱復合材料組成，其中rGO填料沿面間方向取向。相比填料隨機分散的無序結構PDMS基TIMs和填料均面內取向的三明治結構PDMS基TIMs，本文制備的柱廊結構PDMS基TIMs具有更為優異的導熱性能和更低的界面熱阻。此外，柱廊結構PDMS基TIMs還具有優異的電絕緣性能和日間被動輻射冷卻性能，使其在新能源汽車電池組、戶外高壓設備等應用場景下也具有巨大的潛力。