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Thermally conductive polymer composites have become a research hotspot and an important branch in the fields of thermal conduction such as 5G communication equipment, electronic packaging and energy transmission due to their light weight, easy processing and low manufacturing cost, etc. However, the thermal conductivity coefficients (λ) of reported thermally conductive polymer composites are far from expected, and one of the most important reasons is the inherent interfaces between phases in the polymer composites and the high interfacial thermal resistance (ITR). This review summarizes the research history and the latest progress of ITR in thermally conductive polymer composites from 4 aspects: mathematical models, computer simulations, measurement techniques and strategies to reduce ITR. Furthermore, the problems of researches on ITR in urgent need for solution as well as corresponding possible solutions are illuminated, hoping to provide some guiding suggestions for the rapid and efficient improvement on λ of thermally conductive polymer composites.聚合物基導熱復合材料由于具有輕質、易成型加工、低制備成本等諸多優點，已成為5G通訊設備、電子封裝和能量傳輸等導熱領域的研究熱點和重要分支。然而現有聚合物基導熱復合材料的導熱系數（λ）遠低于預期值，其中一個重要的原因在于聚合物基復合材料固有的相界面以及較高的界面熱障。本文從界面熱障的數學模型、計算機模擬、測量方法以及降低界面熱障的策略4個方面對聚合物基導熱復合材料界面熱障的研究歷史與最新進展進行總結，闡明了聚合物基導熱復合材料領域目前亟需解決的界面熱障問題以及可能的解決方法，希冀為聚合物基導熱復合材料λ的快速高效提升提供一些指導性的建議。