Yixin Han, Kunpeng Ruan and Junwei Gu*. Multifunctional Thermally Conductive Composite Films Based on Fungal Tree-like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers. Angewandte Chemie International Edition, 2023, 135(5): e202216093. 2021IF=16.823.（1區化學Top期刊）
https://doi.org/10.1002/anie.202216093
Abstract
Thermal conduction for electronic equipment has grown in importance in light of the burgeoning of 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics and extensive mechanical properties. In this work, “solvothermal & in-situ growth” method is carried out to prepare “Fungal tree”-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) thermally conductive fillers. The thermally conductive AgNWs@BNNS/ANF composite films are obtained by the method of “suction filtration self-assembly and hot-pressing”. When the mass fraction of AgNWs@BNNS is 50 wt%, AgNWs@BNNS/ANF composite film presents the optimal thermal conductivity coefficient of 9.44 W/(m·K) and excellent tensile strength of 136.6 MPa, good temperature-voltage response characteristics, superior electrical stability and reliability, which promise a wide application potential in 5G electronic devices.
通過“溶劑熱法-原位生長法”制備出“真菌樹”狀銀納米線@氮化硼納米片（AgNWs@BNNS）異質結構導熱填料，再與化學解離制備的芳綸納米纖維（ANF）復合，經“抽濾自組裝-熱壓”法制備出AgNWs@BNNS/ANF導熱復合膜。當AgNWs@BNNS的質量分數為50 wt%時，AgNWs@BNNS/ANF導熱復合膜具有優異的導熱性能（導熱系數為9.44 W/(m·K)）和拉伸強度（136.6 MPa）、良好的溫度-電壓響應特性（低供電電壓下的高焦耳加熱溫度（5 V、240.6 ℃）以及快速響應時間（10 s））、優異的電穩定性和可靠性（1000次、6000 s拉伸-彎曲疲勞工作下穩定和恒定的實時電阻）。
本文亮點
1. 通過“溶劑熱法-原位生長法”制備出“真菌樹”狀銀納米線@氮化硼納米片（AgNWs@BNNS）異質結構導熱填料。
2. AgNWs@BNNS/ANF導熱復合膜兼具高達9.44 W/(m·K)的面內熱導率以及優異的拉伸強度（136.6 MPa）。
3. AgNWs@BNNS/ANF導熱復合膜具有良好的溫度-電壓響應特性（如低供電電壓下的高焦耳加熱溫度（5 V、240.6℃）以及快速響應時間（10 s））。
4. AgNWs@BNNS/ANF導熱復合膜具有優異的電穩定性和可靠性（1000次、6000 s拉伸-彎曲疲勞工作下穩定和恒定的實時相對電阻）。