Teng-Bo Ma, Hao Ma, Kun-Peng Ruan, Xue-Tao Shi*, Hua Qiu, Sheng-Yuan Gao and Jun-Wei Gu*. Thermally conductive polylactic acid composites with superior electromagnetic shielding performances via 3D printing technology. Chinese Journal of Polymer Science, 2022, 10.1007/s10118-022-2673-9. 2020IF=3.603.（2區化學類期刊，中國科技期刊卓越行動計劃-梯隊類期刊項目）
https://doi.org/10.1007/s10118-022-2673-9
Abstract
This work proposes a facile fabrication strategy for thermally conductive graphite nanosheets/polylactic acid sheets with ordered GNPs (o-GNPs/PLA) via fused deposition modeling (FDM) 3D printing technology. Further combination of o-GNPs/PLA with Ti3C2Tx films prepared by vacuum-assisted filtration were carried out by “layer by layer stacking-hot pressing” to be the thermally conductive Ti3C2Tx/(o-GNPs/PLA) composites with superior electromagnetic interference shielding effectiveness (EMI SE). When the content of GNPs was 18.60 wt% and 4 layers of Ti3C2Tx (6.98 wt%) films were embedded, the in-plane thermal conductivity coefficient (λ//) and EMI SE (EMI SE//) values of the thermally conductive Ti3C2Tx/(o-GNPs/PLA) composites significantly increased to be 3.44 W/(m·K) and 65 dB (3.00 mm), increased by 1223.1% and 2066.7%, respectively, compared with λ// (0.26 W/(m·K)) and EMI SE// (3 dB) of pure PLA matrix. This work offers a novel and easily route for designing and manufacturing highly thermally conductive polymer composites with superior EMI SE for broader application.
以聚乳酸（PLA）為基體，石墨納米微片（GNPs）為導熱填料，采用熔融沉積成型（FDM）3D打印技術制備GNPs有序排列的GNPs/PLA（o-GNPs/PLA）片材，與真空輔助抽濾法制備的導電Ti3C2Tx薄膜復合，經“層層鋪疊-熱壓”工藝制備Ti3C2Tx/(o-GNPs/PLA)導熱電磁屏蔽復合材料。當GNPs質量分數為20 wt%時，o-GNPs/PLA導熱復合材料具有最佳的綜合性能，其拉伸強度、熔體體積流動速率和面內熱導率（λ//）分別為47.5 MPa、13 cm3/(10 min)和2.90 W/(m·K)，是相同GNPs用量下共混熱壓制備r-GNPs/PLA導熱復合材料λ//（1.82 W/(m·K)）的1.6倍。引入4層Ti3C2Tx（6.98 wt%）薄膜后，Ti3C2Tx/(o-GNPs/PLA)導熱電磁屏蔽復合材料的λ//和面內電磁屏蔽效能（EMI SE//）快速提升至3.44 W/(m·K)和65 dB（3.00 mm），較純PLA的λ//（0.26 W/(m·K)）和EMI SE//（3 dB）分別提升了1223.1%和2066.7%。
論文創新點
1. 采用3D打印技術成功實現了GNPs的有序排列，顯著提高了有序排列GNPs/PLA（o-GNPs/PLA）導熱復合材料的面內導熱系數（λ//）；
2.將o-GNPs/PLA與Ti3C2Tx薄膜優化復合，經“層層鋪疊-熱壓”工藝實現了Ti3C2Tx/(o-GNPs/PLA)復合材料的高導熱和優異的電磁屏蔽性能。