近日，SFPC課題組氰酸脂樹脂改性研究成果發表在Polymer Chemistry，并被Editors選為HOT article。
論文信息：Chaofan Wang, Yusheng Tang*, Yuxiao Zhou, Yanyao Zhang, Jie Kong, Junwei Gu, Junliang Zhang*. Cyanate ester resins toughened with epoxy-terminated and fluorine-containing polyaryletherketone. Polymer Chemistry, 2021, 12 (26): 3753-3761. 2020IF = 5.582.
論文鏈接：https://doi.org/10.1039/D1PY00597A (Free to access until 12th August 2021)
Abstract
Cyanate ester resins are widely utilized in high-performance printed circuit boards, radar radomes, communication satellites, and other fields. However, the poor toughness after curing due to the highly cross-linked and symmetrical triazine ring structure severely limits their wide application. Herein, a novel epoxy-terminated and fluorine-containing polyaryletherketone (EFPAEK) synthesized from bisphenol AF, difluorobenzophenone, and epichlorohydrin was applied to modify the bisphenol A dicyanate ester (BADCy) resin. The results showed that the EFPAEK/BADCy resin toughened with 20 wt% of EFPAEK displayed the best comprehensive properties. The dielectric constant and the dielectric loss tangent values at 1 MHz were 2.64 and 0.006, respectively, which were much lower than those of the pure BADCy resin (3.09 and 0.008). In addition, the flexural strength and impact strength of the corresponding EFPAEK/BADCy resin increased significantly to 131.8 MPa and 30.6 kJ m?2, respectively, which were 32.5% and 159.3% higher compared to the pure BADCy resin (99.5 MPa and 11.8 kJ m?2). Besides, the modified BADCy resin still maintained high thermal stability, by showing the highest heat resistance index of 219.5℃, which increased by 4.2% compared with the pure BADCy resin (210.6℃). Moreover, the addition of EFPAEK improved the bonding strength. The maximum bonding strength of the EFPAEK/BADCy resin was 22.2 MPa, which was 91.4% higher compared to that of the pure BADCy resin (11.6 MPa). Additionally, the EFPAEK/BADCy resin demonstrated improved water resistance as the minimum water absorption rate decreased by 30.9% compared to that of the pure BADCy resin.
氰酸酯樹脂廣泛應用于高性能印刷電路板、雷達天線罩、通信衛星等領域。然而，由于高度交聯的對稱三嗪環結構，固化后的氰酸脂樹脂韌性較差，嚴重限制了其廣泛應用。本文以雙酚AF、二氟二苯甲酮和環氧氯丙烷為原料合成了一種端基為環氧基且主鏈含氟的聚芳醚酮（EFPAEK），并將其用于改性雙酚A氰酸脂樹脂（EFPAEK/BADCy）。結果表明，1 MHz下，當EFPAEK的質量分數為20 wt%時，EFPAEK/BADCy樹脂具有最佳的綜合性能。其介電常數（ε）和介電損耗角正切值（tanδ）分別為2.64和0.006（均低于純BADCy的ε和tanδ，3.09和0.008）；彎曲強度和沖擊強度分別為131.8 MPa和30.6 kJ m?2，較純BADCy樹脂的彎曲強度（99.5 MPa）和沖擊強度（11.8 kJ m?2）分別提高了32.5%和159.3%。同時，改性后的BADCy樹脂仍保持了較高的熱穩定性，其最高耐熱指數為219.5℃，比純BADCy樹脂（210.6℃）提高了4.2%。EFPAEK的加入也提高了粘接強度。EFPAEK/BADCy樹脂的最大粘結強度為22.2 MPa，比純BADCy樹脂（11.6 MPa）提高了91.4%。此外，EFPAEK/BADCy樹脂具有較好的耐水性，其最小吸水率與純BADCy樹脂相比降低了30.9%。