Kunpeng Ruan#, Xiao Zhong#, Xuetao Shi*, Jinjin Dang and Junwei Gu*. Liquid crystal epoxy resins with high intrinsic thermal conductivities and their composites: A mini-review. Materials Today Physics, 2021, 20: 100456. 2019IF=10.443.（1區(qū)材料科學(xué)Top期刊）
https://doi.org/10.1016/j.mtphys.2021.100456
Abstract
Owing to the excellent mechanical properties and thermal stability, outstanding electrical insulation and chemical resistance, as well as easy processing and low cost, epoxy resins are widely used in electronics and electrical fields. However, the intrinsic thermal conductivity coefficients (λ) of the traditional epoxy resins are low, which is far from being able to meet the high thermal conduction/dissipation requirements of high-power electrical equipment or electronic components. By designing and changing the structures of molecules and chain links to obtain special physical structures (such as orientation structure, liquid crystal structure and crystalline structure, etc.), the high intrinsic λ of epoxy resins can be achieved. This paper reviews the classification, preparation methods, research progresses and thermal conduction mechanisms of intrinsically thermally conductive liquid crystal epoxy resins. The research progresses and academic achievements of existing intrinsically thermally conductive liquid crystal epoxy resins and their composites are focused on, and the influencing factors on the intrinsic thermal conductivities of liquid crystal epoxy resins are discussed. Finally, the development trends and prospects of intrinsically thermally conductive liquid crystal epoxy resins and their composites are pointed out.
環(huán)氧樹脂由于具有優(yōu)異的力學(xué)性能和熱穩(wěn)定性、突出的電氣絕緣性和耐化學(xué)腐蝕性，以及易成型加工和低成本等優(yōu)點(diǎn)，廣泛應(yīng)用于電子、電氣和電機(jī)等領(lǐng)域。然而，傳統(tǒng)環(huán)氧樹脂基體的本征導(dǎo)熱系數(shù)（λ）低，遠(yuǎn)不能滿足高功率電氣設(shè)備或電子元器件的高導(dǎo)/散熱需求。通過設(shè)計(jì)和改變分子和鏈節(jié)的結(jié)構(gòu)來獲得特殊的物理結(jié)構(gòu)（如取向結(jié)構(gòu)、液晶和結(jié)晶結(jié)構(gòu)等），可以實(shí)現(xiàn)環(huán)氧樹脂的本征高導(dǎo)熱性能。本文就本征型導(dǎo)熱液晶環(huán)氧樹脂的分類、制備方法、研究進(jìn)展和導(dǎo)熱機(jī)理進(jìn)行了綜述，重點(diǎn)討論了現(xiàn)有本征高導(dǎo)熱液晶環(huán)氧樹脂及其復(fù)合材料的研究進(jìn)展與學(xué)術(shù)成果，以及液晶環(huán)氧樹脂本征導(dǎo)熱性能的影響因素，最后指出本征型導(dǎo)熱液晶環(huán)氧樹脂基體及其復(fù)合材料的發(fā)展趨勢和應(yīng)用前景。