Xutong Yang, Shuguang Fan, Ying Li*, Yongqiang Guo, Yunge Li, Kunpeng Ruan, Shengmao Zhang, Junliang Zhang, Jie Kong and Junwei Gu*. Synchronously improved electromagnetic interference shielding and thermal conductivity for epoxy nanocomposites by constructing 3D copper nanowires/thermally annealed graphene aerogel framework. Composites Part A: Applied Science and Manufacturing, 2020, 128: 10567.2018IF=6.282. (1區/Top期刊：復合材料領域頂尖期刊).
Abstract: 3D copper nanowires-thermally annealed graphene aerogel (CuNWs-TAGA) framework is firstly prepared by freeze-drying followed by thermal annealing from CuNWs, graphene oxide (GO) and L-ascorbic acid. Epoxy resin is then poured back into the above 3D CuNWs-TAGA framework to fabricate the CuNWs-TAGA/epoxy nanocomposites. CuNWs with average diameter of about 120?nm and length of approximate 10?μm are successfully prepared. When the mass fraction of CuNWs-TAGA is 7.2 wt% (6.0–1.2 wt% CuNWs-TAGA), the thermal conductivity coefficient (λ) value of the CuNWs-TAGA/epoxy nanocomposites reaches the maximum of 0.51 W/mK. Meantime, the CuNWs-TAGA/epoxy nanocomposites exhibit the maximum electromagnetic interference shielding effectiveness (EMI SE) value of 47?dB and electrical conductivity (σ) of 120.8 S/m, ascribed to perfect 3D CuNWs-TAGA conductive network structures. Meanwhile, the corresponding elasticity modulus, hardness, glass transition temperature (Tg) and heat-resistance index (THRI) of the CuNWs-TAGA/epoxy nanocomposites increase to 4.69? GPa, 0.33? GPa, 126.3?°C and 181.7?°C, respectively.
附論文鏈接：
https://doi.org/10.1016/j.compositesa.2019.105670