Junwei Gu*, Kunpeng Ruan. Breaking Through
Bottlenecks for Thermally Conductive Polymer Composites: A Perspective for
Intrinsic Thermal Conductivity, Interfacial Thermal Resistance and Theoretics. Nano-Micro
Letters, 2021, 13: 110. 2019IF=12.264.
https://link.springer.com/article/10.1007/s40820-021-00640-4
Abstract
Rapid development of energy, electrical and
electronic technologies has put forward higher requirements for the thermal
conductivities of polymers and their composites. However, the thermal conductivity
coefficient (λ) values of prepared thermally conductive polymer
composites are still difficult to achieve expectations, which has become the
bottleneck in the fields of thermally conductive polymer composites. Aimed at
that, based on the accumulation of the previous research works by related
researchers and our research group, this paper proposes three possible
direction for breaking through the bottlenecks: (1) preparing and synthesizing
intrinsically thermally conductive polymers, (2) reducing the interfacial
thermal resistance (ITR) in thermally conductive polymer composites, and (3)
establishing suitable thermal conduction models and studying inner thermal
conduction mechanism to guide experimental optimization. Also, the future
development trends of the three above-mentioned directions are foreseen, hoping
to provide certain basis and guidance for the preparation, researches and
development of thermally conductive polymers and their composites.
能源、電氣和電子技術(shù)的高速發(fā)展對高分子及其復(fù)合材料的導(dǎo)熱性能提出了更高的要求。然而，目前制備的導(dǎo)熱高分子復(fù)合材料的導(dǎo)熱系數(shù)（λ）大多仍然難以達到預(yù)期，已成為導(dǎo)熱高分子復(fù)合材料領(lǐng)域內(nèi)一大瓶頸問題。針對此，本文基于相關(guān)研究者與本課題組前期研究工作的積累，提出了突破瓶頸的三個可能方向——制備合成本征型導(dǎo)熱高分子材料、降低導(dǎo)熱高分子復(fù)合材料中的界面熱障以及建立并研究合適的導(dǎo)熱模型與機理指導(dǎo)實驗優(yōu)化，并對三個方向未來的發(fā)展趨勢進行前瞻，希冀為導(dǎo)熱高分子及其復(fù)合材料的制備、研究與發(fā)展提供一定的依據(jù)與指導(dǎo)。