Spectroscopically Detecting Molecular-Level Bonding Formation between an Epoxy Formula and Steel
作者：Zhaohui Xu, Yinyu Zhang, Yeping Wu*, and Xiaolin Lu*
關鍵字：Adhesion, SFG, epoxy, steel
論文來源：期刊
具體來源：Langmuir 2022, 38, 13261–13271.
發表時間：2022年
The formation of the interfacial adhesion between an epoxy adhesive and a substrate was normally accompanied by the epoxy curing process on the substrate. Although the debate on the formation mechanism of the interfacial adhesion is still ongoing, this issue can causally be resolved by studying the interfacial structural formation between the epoxy adhesive and the substrate. Herein, to reveal the interfacial structural formation of a representative formula composed of epoxy (digylcidyl ether of biphenyl A, DGEBA) and amine hardener (2,2′-(ethylenedioxy) diethylamine, EDDA) with the steel substrate upon curing and postcuring treatments, sum-frequency generation (SFG) vibrational spectroscopy with a sandwiched transparent window/epoxy adhesive/steel setup was applied to detect and track the buried molecular-level structures at the epoxy adhesive/steel interface. An X-ray photoelectron spectroscopic (XPS) experiment was performed to probe the intentionally exposed interface to disclose the occurring interfacial chemical reaction. The reaction between the epoxy groups and the steel-surface OH groups and the molecular reconstruction of interfacial epoxy methyl groups upon curing and postcuring steps were confirmed. The latter also indirectly indicated the formation of the additional hydrogen bonding and the former bonding reaction at the interface. The above two spectroscopic experimental results matched up with the further examination of the adhesion strength. Therefore, this work elucidates the formation of the interfacial bonding between the epoxy formula and the steel substrate upon curing and postcuring treatments at the molecular level, thus providing an in-depth insight into the origin of the interfacial adhesion.
https://pubs.acs.org/doi/10.1021/acs.langmuir.2c02325